SURFACE PREPARATIONS

One of the most important factors for high quality results of the plating or surface treatments is the cleanliness and condition of the alloy surface prior to plating. Commonly there are two methods to cleaning components prior to treatments. One method is mechanical, through polishes, solvents and using normal mold polishing techniques. The second is to set the component up for plating and momentarily run the plating apparatus in reverse polarity to "clean or etch" the part. It is important to note that this reverse polarity cleaning process DOES and WILL REMOVE measurable amounts of material from all surfaces of the part exposed to the process bath. So it is imperative to monitor and control the length of this cleaning cycle.

It is also important to note that areas of a part left exposed to vapor, above the bath, can also be affected both during the plating process and the cleaning process, so masking may be needed to protect the part from unintentional etching effects or material lose.

When an anode is used to plate a cavity, recess or rib area it is imperative to protect areas, other than area specifically to be plated, with masking procedures resistant to the process. This is to prevent etching or removal of material in often critical areas.